Integration Development Trend of High-Voltage Modular Power Supplies

1. Core Drivers of Integration Development
As the energy core of electronic equipment, the integration trend of high-voltage modular power supplies stems from the upgraded demand for "miniaturization, high energy efficiency, and low loss" in modern industry. In fields such as medical imaging and industrial testing, the volume of equipment is continuously decreasing. Traditional discrete high-voltage power supplies can no longer meet the miniaturization needs of equipment due to scattered components, complex wiring, and low duty cycles. At the same time, the increasing demand for power supply energy efficiency in scenarios such as new energy power generation and rail transit has driven the adoption of integrated designs. These designs optimize topological structures, reduce parasitic parameters, lower circuit losses, and improve energy utilization efficiency.
2. Key Technical Paths for Integration
(1) Power Density Enhancement Technology
The Multi-Chip Module (MCM) process is adopted to package core components such as high-voltage switching tubes, rectifier bridges, and filter capacitors into an integrated module. This reduces the length of external circuits, lowers distributed inductance and capacitance, and improves the stability of power supplies under high-frequency operation. For example, in a 10kV high-voltage module, the integration of SiC MOSFET chips with drive circuits can increase power density from the traditional 5W/cm³ to over 12W/cm³ while reducing switching losses by 40%. Additionally, breakthroughs in planar transformer technology—combining thin magnetic core materials with multi-layer PCB windings to replace traditional wound transformers—reduce the transformer volume by 60%, further compressing the overall size of the module.
(2) Integrated Thermal Management Design
High-voltage modules easily generate local hotspots during high-power output, making integrated thermal management systems critical. Through thermoelectric coupling simulation, thermal dissipation structures and circuit layouts are co-designed. A composite heat dissipation solution combining thermal pads, heat sinks, and micro fans is used, or liquid cooling channels are integrated into high-power modules for rapid heat transfer. For instance, in a 6kV industrial high-voltage module, an integrated liquid cooling system can control the temperature of core components below 85℃, a 25℃ reduction compared to traditional heat dissipation methods, extending component lifespan by more than 3 times.
(3) Integration of Control Circuits
Digital control chips (e.g., DSP, FPGA) are integrated with high-voltage drive circuits and protection circuits on the same substrate to achieve integrated "power conversion + control + protection" functions. Built-in adaptive PID algorithms adjust output voltage and current in real time, increasing response speed to the microsecond level, while triple protection functions (overvoltage, overcurrent, and overtemperature) are incorporated. In high-voltage power supply modules for communication base stations, this integrated control scheme can reduce power supply output ripple to within 0.5%, meeting the strict power stability requirements of base station equipment.
3. Application Scenarios and Future Outlook
Currently, integrated high-voltage modules are widely used in portable X-ray detectors (with module volume reduced to 1/3 of traditional products and weight below 2kg) and on-board high-voltage auxiliary power supplies for new energy vehicles (with energy efficiency increased to 94%). In the future, with the maturity of 3D IC technology, high-voltage modules will achieve full-dimensional integration of "chip-packaging-system". Combined with AI intelligent diagnosis functions, real-time monitoring of module operating parameters will enable fault risk prediction, further improving equipment reliability.