Multi-resonant Cavity Cooperative Voltage Stabilization for High-Voltage Power Supply in Lithography Machines

In advanced semiconductor manufacturing, lithography machines, known as "chip printing presses," have their exposure precision directly determining the limit of chip process nodes. As the energy core of lithography light sources (e.g., extreme ultraviolet (EUV) light), high-voltage power supplies must meet the strict requirements of nanoscale processes for voltage stability (ripple rate ≤ 0.1%) and dynamic response speed (microsecond level). Traditional single-resonant-cavity high-voltage power supplies, due to their single resonant frequency, struggle to simultaneously suppress wide-band ripples and quickly respond to load fluctuations. When the wafer stage of a lithography machine performs nanoscale stepping movements, the light source load exhibits instantaneous pulse changes, and single-resonant-cavity power supplies are prone to voltage overshoot or undershoot, leading to uneven exposure energy and affecting pattern transfer accuracy.
The multi-resonant cavity cooperative voltage stabilization technology solves this contradiction through topological innovation and control strategy optimization. This technology adopts a "series-parallel hybrid resonant cavity topology," designing 3-5 independent resonant cavities by frequency segments: low-frequency (50-100 kHz) resonant cavities suppress fundamental ripples from the power grid, medium-frequency (500 kHz-1 MHz) ones target power switch noise, and high-frequency (5-10 MHz) ones address instantaneous load fluctuations. Each resonant cavity communicates cooperatively via an FPGA (Field-Programmable Gate Array) control unit, which real-time collects output voltage waveforms and load current changes, and dynamically allocates the voltage stabilization weight of each cavity using a "weighted adaptive algorithm." When the load generates a microsecond-level pulse, the high-frequency resonant cavity prioritizes capacitor discharge compensation, while medium and low-frequency resonant cavities synchronously adjust energy storage status to avoid overload of a single cavity.
In practical applications, this technology has been verified in lithography machines for 14nm and smaller process nodes: its output voltage ripple rate can be reduced to below 0.05%, dynamic response time shortened to 2μs, and compared with traditional power supplies, it reduces lithography pattern line width error by 30% and improves yield by 8%-12%. Additionally, the cooperative mechanism reduces power loss of individual resonant cavities, increasing the overall power supply efficiency from 85% to 92%, which aligns with the low-energy consumption requirements of semiconductor manufacturing. With the development of 3nm and 2nm processes, multi-resonant cavity technology will further integrate AI predictive control, realizing "predictive voltage stabilization" by learning load patterns in different wafer exposure scenarios, providing more stable energy support for EUV lithography.