Miniaturization Path of High-Voltage Power Supplies for Exposure Machines

1. Technical Requirements of Exposure Machines for HV Power
Exposure machines, as core equipment in semiconductor and display manufacturing, demand HV power supplies to: 
• Deliver high-precision output with voltage fluctuations <0.1% to ensure stable light source energy and prevent pattern distortion. 
• Respond rapidly (millisecond-level adjustments) for plasma etching synchronization. 
• Achieve miniaturization to fit multi-beam and EUV systems while providing multi-channel HV output in confined spaces. 
2. Core Technical Challenges
• Insulation and Thermal Management: High component density increases arc discharge risk and local overheating. Solutions include ceramic-filled insulation and optimized thermal channels. 
• Parasitic Effects: Distributed capacitance and leakage inductance in high-frequency transformers cause voltage spikes. Mitigation requires segmented winding and magnetic shielding. 
• Light-Load Stability: Traditional topologies fail under μA-level loads. Adaptive feedback circuits and pre-regulation are essential. 
3. Key Miniaturization Technologies
• Piezoelectric Transformers: Replace coils with piezoelectric materials, reducing volume by >50% and enabling >100 kHz responses. Energy density is 3× higher than conventional transformers. 
• High-Frequency Resonance (LLC): Soft-switching techniques in half-bridge circuits allow MHz operation, shrinking passive components. A 25kV/1mA prototype achieved 160mm×135mm×43mm dimensions. 
• Modular Integration: Functional blocks (rectification, regulation) are 3D-stacked. Potting compounds minimize safety distances, doubling power density. 
Table: Miniaturization Technologies Comparison 
Technology Size Reduction Efficiency Gain Application
Piezoelectric Transformer >50% 85%→92% Micro-UV Exposure
High-Frequency LLC 40%-60% 80%→90% Projection Light Source
Potted Modular Design 30%-50% Multi-Channel Systems
 
4. Future Trends
• Advanced Materials: Nano-ceramic composites enhance insulation and thermal conductivity. Superconductors may enable ultra-HV modules for EUV machines. 
• Smart Systems & Hybrid Energy: IoT-based monitoring enables predictive maintenance. Solar-HV direct supply architectures reduce conversion losses. 
• Standardization: International standards for voltage endurance, ripple, and EMC will accelerate domestic industrialization and cross-industry collaboration. 
Conclusion
Miniaturized HV power supplies are pivotal for next-generation exposure machines. Innovations in piezoelectric technology, resonant topologies, and modular design resolve the trade-offs between size and performance. Future advancements in materials and intelligent controls will further enhance precision and cost-efficiency, underpinning the autonomy of semiconductor and display industries.