Process Innovation Highlights of High-Frequency High-Voltage Power Supply Manufacturers
The performance improvement of high-frequency high-voltage power supplies (usually referring to switching frequency ≥20kHz and output voltage ≥10kV) is highly dependent on process innovation. Manufacturers achieve significant improvements in power supply efficiency, reliability, and integration through technological breakthroughs in four fields: topological structure optimization, heat dissipation process upgrade, electromagnetic compatibility (EMC) control, and precision manufacturing, forming differentiated process advantages.
The innovation of topological structure is the core process breakthrough point of high-frequency high-voltage power supplies. Traditional high-frequency high-voltage power supplies mostly adopt a single-stage full-bridge topology, which has the problems of large switching loss and low efficiency in high-voltage output scenarios. Leading manufacturers effectively solve this problem by developing a combined structure of interleaved parallel topology and resonant topology: the interleaved parallel structure operates multiple conversion units in parallel, and the switching frequency of each unit is staggered, reducing the input current ripple by 50% and reducing the volume of filter components. The resonant topology (such as LLC resonant topology) realizes zero-voltage switching (ZVS) and zero-current switching (ZCS) of switching tubes, reducing switching loss by 70%, and maintaining the power supply efficiency above 92% in the full load range (the efficiency of traditional topology is only 85% at light load). In addition, for the voltage doubling circuit of high-voltage output, manufacturers adopt a modular design process to standardize the voltage doubling unit, which can be flexibly combined according to the output voltage demand, shortening the product customization cycle by 30% and improving the circuit stability at the same time.
The upgrade of heat dissipation process solves the heat generation problem of high-frequency high-voltage power supplies. The switching loss caused by high frequency and the conduction loss under high voltage significantly increase the heat density of power devices (such as IGBT and SiC MOSFET) inside the power supply (up to 50W/cm²), and traditional air-cooled heat dissipation can no longer meet the demand. Leading manufacturers adopt a composite heat dissipation process of "liquid cooling + vapor chamber": the liquid cooling system adopts a microchannel structure, and the coolant (such as ethylene glycol aqueous solution) flows at a speed of 2m/s in the microchannel, and the heat dissipation coefficient is 4 times higher than that of traditional air cooling. The vapor chamber homogenizes the hot spot temperature on the surface of power devices through the vacuum cavity and working medium phase change, controlling the temperature difference within 5℃ and avoiding device failure caused by local overheating. At the same time, manufacturers optimize the heat dissipation structure through thermal simulation software (such as ANSYS Icepak), reducing the volume of the heat dissipation system by 25% and the weight by 30%, adapting to the compact installation needs of industrial equipment.
EMC control process ensures the stable operation of power supplies in complex environments. The switching action of high-frequency high-voltage power supplies will generate strong electromagnetic radiation. If EMC control is poor, it will not only interfere with surrounding equipment but also affect its own control accuracy. Leading manufacturers optimize the EMC process from the dual dimensions of "source suppression + propagation path blocking": in terms of source suppression, synchronous drive technology is adopted to control the synchronization of switching actions of multiple switching tubes within 10ns, reducing the harmonic components of electromagnetic radiation. In terms of propagation path blocking, a multi-layer shielding structure is adopted, the inner layer is copper foil shielding (suppressing electric field radiation), and the outer layer is permalloy shielding (suppressing magnetic field radiation). At the same time, multi-stage EMC filters (including common-mode inductors, X capacitors, and Y capacitors) are designed at the input and output ends of the power supply, enabling the power supply to meet the EN 55022 Class B standard and reducing the radiation disturbance limit by 10dBμV/m. In addition, manufacturers complete the EMC pre-test in the product R&D stage through an automated EMC test platform, avoiding later rectification costs and shortening the R&D cycle by 20%.
Precision manufacturing process improves product consistency and reliability. High-frequency high-voltage power supplies have high requirements for circuit layout and component welding accuracy. Small process errors may lead to uneven electric field distribution or increased contact resistance, causing faults. Leading manufacturers introduce automated production lines: high-precision placement machines are used to realize high-precision placement of components (with a precision of ±0.05mm), avoiding manual placement errors; laser welding technology is used instead of traditional soldering iron welding, the welding temperature control precision reaches ±2℃, the solder joint strength is increased by 30%, and the contact resistance is reduced by 50%. In the product testing link, a fully automated testing system is adopted, which can complete the testing of 20 parameters such as output voltage, ripple, efficiency, and EMC at the same time. The testing time is shortened from 30 minutes to 5 minutes, and the testing data is automatically uploaded to the MES system to realize the whole life cycle traceability. Through the precision manufacturing process, the product defect rate is controlled below 0.2%, which is far lower than the industry average of 0.5%.
