Research on the Improvement of Target Utilization Rate of High-Voltage Power Supply for Magnetron Sputtering

Today, with the widespread application of magnetron sputtering technology, the improvement of the target utilization rate is a key research direction. The high-voltage power supply for magnetron sputtering, as a core component in the magnetron sputtering system, has a significant impact on the target utilization rate.
During the magnetron sputtering process, the electric field provided by the high-voltage power supply ionizes the gas to generate plasma. Ions bombard the target material under the action of the electric field, causing the atoms or molecules on the surface of the target material to sputter out and deposit on the substrate to form a thin film. The performance of the high-voltage power supply directly affects the generation and distribution of the plasma, and thus affects the sputtering efficiency and utilization rate of the target material.
The setting of appropriate parameters of the high-voltage power supply can optimize the state of the plasma. For example, by adjusting the output voltage and frequency of the power supply, the energy of the ions and the rate of bombarding the target material can be controlled. When the voltage is too high, the energy of the ions is too large, which will lead to excessive sputtering on the surface of the target material, forming sputtering pits and reducing the utilization rate of the target material. On the other hand, if the voltage is too low, the energy of the ions is insufficient, and the sputtering efficiency is low. By precisely controlling the power supply parameters, the energy distribution of the ions can be made more uniform, the uneven sputtering on the surface of the target material can be reduced, and the utilization rate of the target material can be improved.
In addition, the stability of the high-voltage power supply is also a key factor. An unstable power supply will cause fluctuations in the plasma, making the process of ion bombarding the target material unstable, resulting in local excessive sputtering or insufficient sputtering of the target material. Adopting a high-quality power supply design and advanced control technology can ensure the stability of the power supply output, keep the plasma uniform and stable during the sputtering process, and improve the overall utilization rate of the target material.
The high-voltage power supply in pulse mode also has unique advantages in improving the target utilization rate. By periodically changing the output voltage and current, the pulse power supply can form different sputtering areas on the surface of the target material, reduce the heat accumulation on the surface of the target material, and avoid local overheating and deformation of the target material. At the same time, the pulse power supply can also improve the control accuracy of the ion energy during the sputtering process, further optimize the sputtering effect, and improve the target utilization rate.
In conclusion, the high-voltage power supply for magnetron sputtering can significantly improve the utilization rate of the target material through reasonable parameter setting, stable output, and the adoption of the pulse mode. In practical applications, according to different sputtering processes and target material characteristics, selecting a suitable high-voltage power supply and optimizing the adjustment is an important way to improve the economic benefits and product quality of the magnetron sputtering technology.