Sputtering coating_Semiconductor

Sputtering coating

Ripple better than 0 1% peak-to-peak; arc fast recovery; low arc discharge current; nanosecond-level protection response

Sputtering coating technology uses high-energy particles (such as argon ions) to bombard the target material in a vacuum environment, so that the on the surface of the target material gain enough energy to escape, forming a beam of neutral atoms or molecules, which are then deposited on the surface of the substrate to form a film
The process is usually carried out under low pressure, and a gas (usually argon) is introduced into the vacuum chamber, and a glow discharge is generated under high voltage, ionized gas.