Practical Implementation of Domestic High-Voltage Power Supplies in CMP Equipment
The localization of high-voltage power systems for chemical mechanical polishing equipment has progressed from basic component substitution to complete system-level integration that meets or exceeds imported performance specifications while addressing unique domestic fab requirements for supply chain security, service response time, and cost structure.
Early localization efforts focused on replacing imported high-voltage transformers and multiplier assemblies with domestically wound units using high-purity ferrite cores and triple-insulated wire. These components achieved equivalent breakdown strength and parasitic capacitance through refined winding geometry and vacuum impregnation processes that eliminated voids more effectively than some overseas suppliers. The critical breakthrough came in mastering the deposition of thin-film resistive dividers directly onto ceramic substrates, yielding voltage feedback accuracy better than 0.1% across temperature without reliance on imported precision resistor networks.
Power semiconductor selection leveraged the rapid maturation of domestic silicon carbide devices rated for 1700 V operation. These parts, initially qualified through extensive cosmic ray testing at high-altitude facilities, demonstrated single-event burnout rates comparable to leading international foundries while offering 40% lower on-resistance that translated directly into reduced cooling requirements. System designers capitalized on this by implementing immersion cooling with domestic single-phase fluids, eliminating the complex two-phase systems required by higher-loss imported devices.
Control electronics localization required development of radiation-hardened field-programmable gate arrays capable of executing complex multi-zone voltage sequencing at microsecond resolution. Domestic foundries delivered 65 nm devices with embedded analog-to-digital converters that met the stringent noise floor requirements for picoampere leakage detection, previously a limiting factor that forced continued import of mixed-signal controllers.
Safety certification represented a significant hurdle. Domestic supplies incorporated triple-redundant interlock architecture with diverse sensing technologies—optical, magnetic, and capacitive—to achieve SIL-3 functional safety rating under domestic standards that aligned with international requirements. The implementation of fiber-optic command links for voltage setpoint transmission eliminated ground potential differences that had caused intermittent arcing in early prototypes.
Thermal management solutions evolved toward liquid-cooled cold plates manufactured using domestic vacuum brazing techniques that achieved void-free copper-aluminum joints. This permitted operation at coolant temperatures up to 60°C without derating, a critical advantage in water-scarce regions where cooling tower performance varies seasonally.
Field replacement units were designed around quick-connect high-voltage connectors with integrated shielding and self-aligning features that reduced mean time to repair from hours to minutes. The connector bodies used domestic high-temperature engineering plastics that maintained dimensional stability after thousands of mating cycles.
Software development followed a modular approach with core control algorithms written in domestic real-time operating systems that supported deterministic execution of multi-zone profiles. The user interface adopted the same command structure as imported systems, enabling drop-in recipe compatibility that minimized retraining requirements.
Reliability growth testing involved continuous operation at 120% rated voltage and current for 5000 hours while subjecting units to vibration profiles derived from actual 300 mm polisher measurements. Failure analysis of early units revealed corona-induced insulation degradation that was resolved through improved electrode edge radiusing and addition of semiconductive stress-grading layers.
Supply chain integration reached completion with establishment of domestic sources for every component down to the high-voltage ceramic capacitors using barium titanate formulations optimized for minimum voltage coefficient. This eliminated foreign exchange risk and reduced lead times from months to weeks.
Production tools equipped with fully localized supplies have now accumulated millions of operating hours across multiple 28 nm and 14 nm lines, demonstrating defect rates and energy consumption equivalent to or better than imported equivalents while achieving 30-40% reduction in total ownership cost through lower acquisition price and dramatically reduced service expenses.
